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dc.contributor.authorWong, Yuen-Yeeen_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorYang, Tsung-Hsien_US
dc.contributor.authorChang, Jet-Rungen_US
dc.contributor.authorChen, Yi-Chengen_US
dc.contributor.authorKu, Jui-Taien_US
dc.contributor.authorLee, Ching-Tingen_US
dc.contributor.authorChang, Chun-Weien_US
dc.date.accessioned2014-12-08T15:09:52Z-
dc.date.available2014-12-08T15:09:52Z-
dc.date.issued2009-03-01en_US
dc.identifier.issn0022-0248en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jcrysgro.2008.12.051en_US
dc.identifier.urihttp://hdl.handle.net/11536/7550-
dc.description.abstractThe defect structure of GaN film grown on sapphire by plasma-assisted molecular beam epitaxy (PAMBE) depends on the growth temperature and thickness of the aluminum nitride (AlN) buffer layer. High-resolution X-ray diffraction was used to measure symmetric (0 0 0 2) and asymmetric (1 0 (1) over bar 2) rocking curve (omega-scans) broadening, which allowed the estimation of screw threading dislocation (TD) and edge TD densities, respectively. For GaN grown on lower-temperature buffer, the density of screw TD was increased while the density of edge TD was decreased. Further examinations revealed that the edge TD was closely related to stress in GaN film and the screw TD was controlled by AlN surface roughness. Since the GaN defect was dominated by edge TD, the total TD was also effectively suppressed with the use of lower-temperature buffer with appropriate thickness. (C) 2009 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectDefectsen_US
dc.subjectHigh-resolution X-ray diffractionen_US
dc.subjectMolecular beam epitaxyen_US
dc.subjectGallium nitrideen_US
dc.titleThe effect of AlN buffer growth parameters on the defect structure of GaN grown on sapphire by plasma-assisted molecular beam epitaxyen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.jcrysgro.2008.12.051en_US
dc.identifier.journalJOURNAL OF CRYSTAL GROWTHen_US
dc.citation.volume311en_US
dc.citation.issue6en_US
dc.citation.spage1487en_US
dc.citation.epage1492en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department友訊交大聯合研發中心zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentD Link NCTU Joint Res Ctren_US
dc.identifier.wosnumberWOS:000265359800008-
dc.citation.woscount8-
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