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dc.contributor.authorHuang, Chia-Shengen_US
dc.contributor.authorCheng, Yu-Tingen_US
dc.contributor.authorChung, Junweien_US
dc.contributor.authorHsu, Wensyangen_US
dc.date.accessioned2014-12-08T15:09:58Z-
dc.date.available2014-12-08T15:09:58Z-
dc.date.issued2009-02-16en_US
dc.identifier.issn0924-4247en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.sna.2008.11.019en_US
dc.identifier.urihttp://hdl.handle.net/11536/7622-
dc.description.abstractThermal bimaterial structures made of Ni and Ni-diamond nanocomposite for sensor and actuator application are proposed, fabricated, and tested. Two deflection types of thermal bimaterial structures, including upward and downward bending types, can be easily fabricated by controlling electroplating sequence of Ni and Ni-diamond nanocomposite. According to thermal performance measurement, the tip deflection of upward and downward types can reach about 82.5 mu m and -22.5 mu m for a temperature change of 200 degrees C, respectively. In the condition, the thermomechanical sensitivity and Output force are 412.5 nm/K and 97.0 mu N for upward type thermal bimaterial structure: and -112.5 nm/K and -26.5 mu N for downward type one. Due to the low electroplating process temperature (similar to 50 degrees C) for both Ni-based layers, diminutive pre-deformation of as-fabricated structure and strong interlaminar bonding strength are verified by SEM and vibrational test. The resonant frequency of the structure remains unchanged after 10(9) cycles. (C) 2008 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectBimaterial structureen_US
dc.subjectBimorphen_US
dc.subjectElectroplatingen_US
dc.subjectNanocompositeen_US
dc.titleInvestigation of Ni-based thermal bimaterial structure for sensor and actuator applicationen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.sna.2008.11.019en_US
dc.identifier.journalSENSORS AND ACTUATORS A-PHYSICALen_US
dc.citation.volume149en_US
dc.citation.issue2en_US
dc.citation.spage298en_US
dc.citation.epage304en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000263620200019-
dc.citation.woscount5-
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