應用於影像系統之太赫茲偵測器電路設計

Abstract

THz技術是半導體領域的未來趨勢。在本論文中，我們提出兩個可應用於成像系統的THz接收機，以及一組THz穿透式全自動2D成像系統。 第一個晶片是太赫茲功率偵測器，使用 TSMC 0.18-μm CMOS 製程。此晶片主要由差動平板天線，功率偵測器，及放大器等電路所組成。由量測得知此電路在中心頻率為0.33 THz 時， resoponsivity可達647 kV/W，其最小的noise equivalent power為114 pW/Hz^0.5。 第二個晶片則是內建解調器的太赫茲影像接收機，使用 TSMC 0.18-μm CMOS 製程。延續第一顆晶片的設計，主要由差動平板天線，功率偵測器，放大器，IQ混頻器，以及IQ結合器所組成。量測結果顯示在0.34 THz時，resoponsivity可達977 kV/W。 THz穿透式成像系統包含電子式訊號源與偵測器、馬達移動平台、自動控制軟體以及光學模組，系統解析度為2 釐米。

The growing trend in high frequency circuits is toward THz band. In this thesis, two THz receivers for imaging application are proposed. We also design a THz 2-D transmissive automated imaging system. The first chip is a THz power detector circuit in TSMC 0.18-μm CMOS technology. The power detector is composed with a patch antenna, a THz detector, amplifier, and an output buffer. From the measurement results, resoponsivity is 647 kV/W and noise equivalent power is 114 pW/Hz^0.5 in common-source with current supply configuration at 0.33 THz. The second chip is a THz receiver with built-in chopping demodulator in TSMC 0.18-μm CMOS technology. This circuit is composed with a patch antenna, a THz detector, an amplifier, an IQ mixer, an IQ combiner and an output buffer. From the measurement results, resoponsivity is 977 kV/W. The THz transmissive imaging system consists of electrical source, electrical detector, motorized stage, auto control software and optical module. System resolution is 2 mm.