利用氟化銨清洗方法於CMP廢水薄膜技術之研究

Abstract

導業在全球篷勃發展，各種製程亦不斷推陳出新，製程所產生的各項廢棄物亦不斷出現，Chemical Machine Polish(化學機械研磨)亦成為晶圓平坦化不可缺少的一項程序，所產生的廢產水增加，產水壓力降低，提昇膜管處理效能，此外，此次實瞼試著尋找較適當水，困擾著全球所有的晶圓廠，並尋求著解決之道。 由於處理CMP廢水的方式繁多，本研究針對利用Micro Filter(MF)膜管處理CMP廢水之方式進行探討，分析其廢水特性及此種過濾處理方法，依據目前設備操作經驗，並利用現有處理設備進行實驗，提出相關方法，延長膜管使用時間，達成降低運轉成本為目的。 經長期運轉發現膜管中的堵塞物，絕大部份為二氧化矽所造成，根據現有的鹼洗清洗方式，並無法將二氧化矽去除，必須要有一套新的方法取代。如能解決二氧化矽之阻塞，即可使膜管壽命順利延長，經研究發現利用化學方式處理可有效解決該一問題，經研究氟化銨(NH4F)進行膜管清洗，可有效去除膜管中二氧化矽(SiO2)之阻塞，順利達成延長膜管使用年限之目的。 經實驗利用氟化銨(NH4F)進行膜管清洗，可以將膜管的清洗模式，降低氟化銨使用安全上的問題，避免膜管產生危害。

Semiconductor industry is thriving in the world. Various processes are developed continuously. Various kind of waste produced in the process also appears continuously. Chemical Machine Polish is an indispensable process for water flatness. The produced waste water is bothering all the wafer plants and makes them search for a solution. There are many ways to treat CMP waste water. This research is for the way that uses MF membranes. In this research, we analyze waste water properties and MF membrane treatment. Carries out an experiment on realistic waste water treatment equipments according to operation experience. After experiments, we obtain some methods to prolong MF membrane life and achier a goal of reducing operation cost. Per a long period of observation, we find most of the stoppage in MF membrane is caused by SiO2. The NaOH clean method we used now can't remove SiO2. It's necessary to replace the old method by a new method. If we solve the SiO2 stoppage, we can successfully prolong the MF membrane life. Per a series of experiments, it show that using chemical treatment can solve this problem efficiently. Using NH4F to clean MF membrane can remove SiO2 efficiently and prolong the life of membranes. Per our experiments, using NF4F on membranes cleaning can increase the water volume, reduce the water pressure, raise the efficient of membranes. In addition, this research also tries to find better way to reduce a danger to human being and an impact to the environment.