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dc.contributor.authorCheng, KLen_US
dc.contributor.authorCheng, HCen_US
dc.contributor.authorLee, WHen_US
dc.contributor.authorLee, CPen_US
dc.contributor.authorLiu, CCen_US
dc.contributor.authorYew, TRen_US
dc.date.accessioned2014-12-08T15:02:04Z-
dc.date.available2014-12-08T15:02:04Z-
dc.date.issued1997-01-13en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://hdl.handle.net/11536/782-
dc.description.abstractPolycrystalline beta-SiC, with grain size up to 1500 Angstrom, has been room-temperature-deposited on Si substrates by electron cyclotron resonance chemical vapor deposition. Microwave power and the hydrogen carrier gas are the key parameters to lower the deposition temperature. According to the results of the cross-sectional transmission electron microscopy, the grain size appeared to be in the same scale as that deposited at 500 degrees C while a large amount of plasma-induced defects were observed in the Si substrate for the room-temperature-deposited samples. Hence, a CH4-plasma treatment prior to the beta-SiC film growth was adopted, forming a SiC-like interfacial layer to suppress the substrate damages. (C) 1997 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleDeposition of polycrystalline beta-SiC films on Si substrates at room temperatureen_US
dc.typeArticleen_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume70en_US
dc.citation.issue2en_US
dc.citation.spage223en_US
dc.citation.epage225en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1997WC05800028-
dc.citation.woscount11-
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