標題: | 以微電阻焊進行微結構組裝的研究 Investigation of Micro Resistive Welding for Assembly of Micro Structures |
作者: | 葉昌旗 Cheng-Chi Yeh 徐文祥 機械工程學系 |
關鍵字: | 微電阻銲;微組裝;micro resistance welding;micro assembly |
公開日期: | 2005 |
摘要: | 在本論文中提出以電阻銲的方式來組裝微結構,在結構設計上利用V型樑電熱式致動器輸出銲接所需要的壓力,藉由結構在接觸面上會產生接觸電阻,在通入電流時候會因此產生局部高溫,使得材料融熔進而產生接合。在量測結果方面,可以得知在我們所設計的幾何尺寸下,接觸電阻可由20Ω左右到3~4Ω之間,但是能達到微電阻銲的範圍在4.6~12Ω之內,而較小的接觸電組在接合時,雖然會消耗較多的輸入功率,但是接合效果與強度較佳。
在微機電的領域中,前人發表的元件幾乎沒有三維立體的微致動器與微感測器,主要原因在於沒有適當的裝配方式。本論文的結果證明微電阻銲應用在微結構組裝上是可行的,同時也能兼顧到訊號與能量的傳遞問題,在未來有很大的機會利用微電阻銲的原理來實現三維立體元件的組裝。 In this thesis, we propose to use micro resistance welding to assemble micro-structure. On structure design, we use bent-beam electro-thermal actuators to export the welding pressure. When we input the current, contact resistance will cause some high temperature in local and make the material melt on the contact surface to result in joint. Form the measure result, we can find the contact resistance is from about 20Ω to 3~4Ω, and the range that can successful weld is from 4.6Ω to 12Ω. Smaller contact resistance will consume more input power while welding, but the joint result and intensity are relatively good. In MEMS field, although much work has been devoted to develop the micro-structures, few researches have been done on three-dimensional micro-actuators or micro-sensors. The key point is no appropriate assembly method. The result in this thesis proves resistance welding is feasible on assembly micro-structure, and it can overcome the problem of transmission question of the signal and energy. In the future, it may have a well chance to apply to realize assembly three-dimensional component by micro resistance welding. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#GT009314502 http://hdl.handle.net/11536/78475 |
顯示於類別: | 畢業論文 |