以六標準差方法探討生產線良率提昇之研究--以電腦主機板表面黏著之製程為例

Abstract

面對主機板製程良率之改善，一般企業雖經全面品質管理展開了各功能之目標，經由品管改善手法、IE手法、PDCA手法及各項改進措施，僅能以局部與片段的改善，無法將產品良率提升至更高之目標水準。唯有6 sigma能以全面性之DMAIC流程及手法，將主機板製程良率更進一步的向上提升。 本研究之目的在運用6 σ品質改善手法，以系統面DMAIC流程及手法，滿足顧客需求及內部流程指標之前提下，找出影響主機板表面黏著製程良率之關鍵因素，並釐清關鍵輸入、流程輸出指標之定義，運用特性要因圖、製程失效模式分析，找出重要影響因子。針對可以量化之輸入、輸出指標，透過實驗設計找到製程之最佳參數，達到穩定的製程；另針對無法量化之影響因素，以Mind_Mapping方式找出有效之對策，使整個製程能被穩定的控制，達到高度的產品品質，進而提升顧客之滿意度。

Face the process yield rate improvements of motherboard, although general enterprises finish deploy goal to each functions by overall quality managements, through quality improvement methods, industry engineering methods, PDCA methods and other improvement solutions, but it is only can be improved partially and unable to enhance the yield rate of product to the target. It only can takes one step ahead to enhance the process yield rate of motherboard with six sigma overall DMAIC process and tactics. This research purpose is used six sigma quality improvement tactics by DMAIC systematic procedure and tactics, found out the key factors that effect to the process yield rate of surface mount technology, and clear the definitions of keys input and process and output index, to satisfy customer requirements and internal process index. We found out the major effective factors by fishbone and process failure mode effective analysis. If the index of input and output that can be quantified, we found out the optimum parameter through design of experiment, make sure the process is stable. If the factor of input and output that can’t be quantified, we found out the effectual countermeasure by Mind_Mapping, make sure whole process can be controlled stably, to reach the high product quality, to enhance the satisfaction of customer.