Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chang, Chia-Yuan | en_US |
dc.contributor.author | Hsu, Heng-Tung | en_US |
dc.contributor.author | Chang, Edward Yi | en_US |
dc.contributor.author | Trinh, Hai-Dang | en_US |
dc.contributor.author | Miyamoto, Yasuyuki | en_US |
dc.date.accessioned | 2014-12-08T15:10:28Z | - |
dc.date.available | 2014-12-08T15:10:28Z | - |
dc.date.issued | 2009-01-01 | en_US |
dc.identifier.issn | 1099-0062 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1149/1.3241014 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/8004 | - |
dc.description.abstract | N-type metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) devices with an InAs-channel using atomiclayer-deposited (ALD) Al(2)O(3) as a gate dielectric have been fabricated and characterized. The device performances of a set of scaled transistors with and without high-k gate dielectric Al(2)O(3) have been compared to determine the optimum device structure for low power and high speed applications. The measurement results revealed that the high performance InAs-channel MOS-HEMTs with the ALD Al(2)O(3) gate dielectric can be achieved if the structure is designed properly. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3241014] All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.title | InAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al(2)O(3) Gate Dielectric | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1149/1.3241014 | en_US |
dc.identifier.journal | ELECTROCHEMICAL AND SOLID STATE LETTERS | en_US |
dc.citation.volume | 12 | en_US |
dc.citation.issue | 12 | en_US |
dc.citation.spage | H456 | en_US |
dc.citation.epage | H459 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
Appears in Collections: | Articles |