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dc.contributor.authorChang, Chia-Yuanen_US
dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorTrinh, Hai-Dangen_US
dc.contributor.authorMiyamoto, Yasuyukien_US
dc.date.accessioned2014-12-08T15:10:28Z-
dc.date.available2014-12-08T15:10:28Z-
dc.date.issued2009-01-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.3241014en_US
dc.identifier.urihttp://hdl.handle.net/11536/8004-
dc.description.abstractN-type metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) devices with an InAs-channel using atomiclayer-deposited (ALD) Al(2)O(3) as a gate dielectric have been fabricated and characterized. The device performances of a set of scaled transistors with and without high-k gate dielectric Al(2)O(3) have been compared to determine the optimum device structure for low power and high speed applications. The measurement results revealed that the high performance InAs-channel MOS-HEMTs with the ALD Al(2)O(3) gate dielectric can be achieved if the structure is designed properly. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3241014] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleInAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al(2)O(3) Gate Dielectricen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.3241014en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume12en_US
dc.citation.issue12en_US
dc.citation.spageH456en_US
dc.citation.epageH459en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
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