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dc.contributor.authorChung, Shu-Hsingen_US
dc.contributor.authorChung, I-Pingen_US
dc.contributor.authorLee, Amy H. I.en_US
dc.date.accessioned2014-12-08T15:10:40Z-
dc.date.available2014-12-08T15:10:40Z-
dc.date.issued2007en_US
dc.identifier.isbn978-3-540-74468-9en_US
dc.identifier.issn0302-9743en_US
dc.identifier.urihttp://hdl.handle.net/11536/8157-
dc.description.abstractSemiconductor production turnkey service (SPTS) coordinates wafer fabrication with the outsourcing of the remaining processes including circuit probing testing (C/P testing), integrated circuit (IC) assembly and final testing for buyers. To reduce the production cost and lead time in the supply chain, wafer fabricators must be responsible for the production and distribution planning for the SPTS. Therefore, this research develops an integer-programming (IP) -based model of collaborative production-distribution planning. Under this model, multi-products, multi-stages, and multi-outsourcing factories with different processing capabilities are considered. However, the IP model cannot solve the problem within a polynomial time when the problem becomes as complicated as those in real practice. To confront this problem, we adopt and modify the generalized saving algorithm (GSA) so that the proposed algorithm can solve complicated real-world problems efficiently. The numerical results show that the proposed algorithm can significantly increase the solving efficiency.en_US
dc.language.isoen_USen_US
dc.subjectSPTSen_US
dc.subjectTPPen_US
dc.subjectnetwork transformationen_US
dc.subjectsemiconductor manufacturingen_US
dc.titleCollaborative production-distribution planning for semiconductor production turnkey serviceen_US
dc.typeProceedings Paperen_US
dc.identifier.journalComputational Science and Its Applications - ICCSA 2007, Pt 1, Proceedingsen_US
dc.citation.volume4705en_US
dc.citation.spage860en_US
dc.citation.epage870en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000250429300070-
Appears in Collections:Conferences Paper