完整後設資料紀錄
DC 欄位語言
dc.contributor.author李德凡en_US
dc.contributor.author袁建中en_US
dc.contributor.authorBenjamin Yuanen_US
dc.date.accessioned2014-12-12T03:08:11Z-
dc.date.available2014-12-12T03:08:11Z-
dc.date.issued2007en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT009435557en_US
dc.identifier.urihttp://hdl.handle.net/11536/81745-
dc.description.abstractDue to the rapidly growing market for IC’s continues, extension of semiconductor manufacturing sites (wafer fabs) are necessary. Companies built new fabs and have to transfer the manufacturing technology to there. The question is how to do that practically. A case study on a technology transfer in the IC industry was performed and interesting insight gained. A set of KPI’s is defined to evaluate the grade of success of the project. By an in depth evaluation of the project setup and a comparison with suggestions from the literature explanations for positive and negative results could be found. The overall positive result of the transfer project is explained by following the recommendations from the literature. To further improve, a suggestion for future projects is that the overall project leader has to be located at the receiving site in order to have better control.zh_TW
dc.language.isoen_USen_US
dc.subjectIntra-firmzh_TW
dc.subjectTechnology transferzh_TW
dc.subjectKnowledge transferzh_TW
dc.subjectIC-industryzh_TW
dc.subjectMultinationalzh_TW
dc.subjectIntra-firmen_US
dc.subjectTechnology transferen_US
dc.subjectKnowledge transferen_US
dc.subjectIC-industryen_US
dc.subjectMultinationalen_US
dc.titleCase Study of a Multinational Intra-firm Technology Transfer in the IC-Industryzh_TW
dc.titleCase Study of a Multinational Intra-firm Technology Transfer in the IC-Industryen_US
dc.typeThesisen_US
dc.contributor.department科技管理研究所zh_TW
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