降低軟片式承載器不良率之參數最佳化研究

Abstract

積體電路(Integrated Circuit，IC)元件隨著電子產品輕薄短小的需求而不斷地演進，液晶顯示器(Liquid Crystal Display，LCD)產業亦是如此。在美、日IC構裝業者與IC載板業者相繼投入研究與開發下，捲帶式自動接合封裝技術(Tape Auto Bonding，TAB)與軟片式承載器(Film Carrier，FC)因應而生。由於FC的組成結構與銅箔蝕刻製程的特性可以製作出比傳統IC導線架尺寸更小的電路，可達到高腳數的需求。但是因為FC的製造技術是移轉自日本，加上材料與線路的精細化，對於國內的FC製造廠來說，要降低產品的不良率非常不易，但是面對整體LCD供應鏈的製造成本必須不斷下降的壓力，FC產品不良率若無法有效降低，品質與成本將不具競爭力，遑論與國內外業者抗衡。因此本研究之主要目的是針對FC產品的最終不良率（即外觀不良率）問題，首先找出可能造成最終外觀不良率的可控因子(Control factors)，然後建立一套最小化FC產品不良率的演算法。本研究是利用田口方法找出造成最終外觀不良率的顯著因子。再以反應曲面法(Response Surface Methodology，RSM)中的中央合成設計(Central Composite Design，CCD)，找出顯著因子的最佳參數水準組合，並以外觀不良率來衡量其效果。本研究以A公司的FC產品-T18為實例，利用本研究方法找出最佳參數水準組合，再進行驗證實驗，結果顯示本研究所得最佳參數水準組合確實有效。據此，FC之相關產品亦可應用本研究方法，在現有的製造條件下尋求關鍵之控制因子之最佳水準組合，以有效降低產品不良率及降低生產成本，據此可建構製程之管制標準，以增強企業的競爭力。

Integrated circuit components continuously develop in line with consumer requirements for thinner and miniaturized electronic products, also the same as Liquid Crystal Display industry. A collaborative effort between manufacturers of chip packages and carriers in USA and Japan has devised a new package technology, i.e., tape automated bonding, and a new wafer chip carrier, film carrier. As a solution to the above limitations, a film carrier can contain thinner channels with a shorter electrical connection distance between chip and system board to comply with high speed communication and numerous channel requirements. Production yield is inferior in fine-pitch film carrier for local manufacturer because process technology was transferred from Japan. Uncompetitive to other film carrier makers in both of quality and production cost when facing lower production yield problem and cost down demain from customer in the supply chain. Therefore, the research proposes a mathematical method to optimize production yield of film carrier. First, use Taguchi method to sort critical controlled factors influenced target quality character from others. Secondly, ultilize Response Surface Methodology allocated Central Composite Design to find out the optimization recipe. The research instances film carrier product-T18 of A company. Through the mathematical method introduced to get the optimized factor-level combination. It’s significantly effectively improving production yield according to the result of confirmation experiments and pilot runs. Consequently, successive products can follow the same methodology to raise production yield and decrease production cost then build up process control standard to enhance competition of company.