完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yang, Po-Chun | en_US |
dc.contributor.author | Kuo, Chien-Chih | en_US |
dc.contributor.author | Chen, Chih | en_US |
dc.date.accessioned | 2014-12-08T15:11:27Z | - |
dc.date.available | 2014-12-08T15:11:27Z | - |
dc.date.issued | 2008-06-01 | en_US |
dc.identifier.issn | 1047-4838 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1007/s11837-008-0077-0 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/8791 | - |
dc.description.abstract | The effect of pre-aging on electromigration is investigated in this study using flip-chip SnAg solder joints. The solder joints were pre-aged at 170 degrees C for 1 h, 3 h, 5 h, 10 h, 25 h, and 50 h, and then they were subjected to electromigration tests of 0.9 A at 150 degrees C. It was found that the average failure time increased about three times when the joints were pre-aged for 3 h to 25 h. But it decreased when the joints were over-aged. It is proposed that the major contributor to the prolonged failure time may be the densification of the nickel and copper under-bump metallization (UBM) and the solder due to the aging treatment. The pre-aging treatment at 170 degrees C may stabilize the microstructure of the solder. The vacancies in the solder were annihilated during the heat treatment, causing a slower diffusion rate. In addition, the UBM structure became denser after the pre-aging process. Thus, the denser UBM structure may lead to slower consumption rates of the nickel and copper layers, resulting in the enhancement of electromigration resistance. | en_US |
dc.language.iso | en_US | en_US |
dc.title | The effect of pre-aging on the electromigration of flip-chip SnAg solder joints | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1007/s11837-008-0077-0 | en_US |
dc.identifier.journal | JOM | en_US |
dc.citation.volume | 60 | en_US |
dc.citation.issue | 6 | en_US |
dc.citation.spage | 77 | en_US |
dc.citation.epage | 80 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000256701200015 | - |
dc.citation.woscount | 0 | - |
顯示於類別: | 期刊論文 |