晶片系統相關實作技術整合推動專案(II)

Full metadata record

DC Field	Value	Language
dc.contributor.author	任建葳	en_US
dc.date.accessioned	2014-12-13T10:32:52Z	-
dc.date.available	2014-12-13T10:32:52Z	-
dc.date.issued	2003	en_US
dc.identifier.govdoc	NSC92-2215-E009-037	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/91757	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=876468&docId=168107	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	晶片系統相關實作技術整合推動專案(II)	zh_TW
dc.title	SoC Promotion Program (II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系	zh_TW
Appears in Collections:	Research Plans

APA	任. (2003). 晶片系統相關實作技術整合推動專案(II). https://www.grb.gov.tw/search/planDetail?id=876468&docId=168107.
Bibtex	@article{2003, title={晶片系統相關實作技術整合推動專案(II)}, author={任建葳}, journal={https://www.grb.gov.tw/search/planDetail?id=876468&docId=168107}, year={2003}, url={https://ir.lib.nycu.edu.tw/handle/11536/91757?mode=full}, }