| 標題: | 高性能混和訊號式介面積體電路---子計畫III：5 GHz高性能無線通訊系統中主要積體電路的設計與整合(II) The Design and Integration of Key Component ICs for 5 GHz High Performance Wireless Communication System (II) |
| 作者: | 吳重雨 CHUNG-YUWU 國立交通大學電子工程學系 |
| 公開日期: | 2003 |
| 官方說明文件#: | NSC92-2215-E009-039 |
| URI: | http://hdl.handle.net/11536/91848 https://www.grb.gov.tw/search/planDetail?id=873480&docId=167338 |
| Appears in Collections: | Research Plans |
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