Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Liang, Cheng-Hsien | en_US |
dc.contributor.author | Chang, Wei-Shin | en_US |
dc.contributor.author | Chang, Chi-Yang | en_US |
dc.date.accessioned | 2014-12-08T15:12:00Z | - |
dc.date.available | 2014-12-08T15:12:00Z | - |
dc.date.issued | 2011-03-01 | en_US |
dc.identifier.issn | 0018-9480 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TMTT.2010.2094202 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/9206 | - |
dc.description.abstract | Tightly coupled lines are difficult to realize on the conventional printed circuit board (PCB). This paper proposes two types of novel enhanced coupled-line structures appropriate for tightly coupled directional couplers and wideband filters. The proposed coupled-line structures both have a rectangular ground-plane aperture and two inserted signal strips in the aperture to increase the coupling strength significantly. No fine lines and narrow gaps are required so as to fit the conventional PCB fabrication process. More importantly, the proposed structures only need a single-layer substrate. To demonstrate the feasibility of the proposed structures, one 3-dB directional coupler and two four-pole Chebyshev filters with 0.05-dB equal-ripple bandwidths of 40% and 37% are designed and realized. The coupler and filters are fabricated on a PCB substrate with a dielectric constant of 3.58 and a thickness of 0.508 mm. Good agreement between measurements and simulations is observed. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Coupled line | en_US |
dc.subject | defected ground structure (DGS) | en_US |
dc.subject | directional coupler | en_US |
dc.subject | microstrip line | en_US |
dc.subject | parallel-coupled microstrip filter | en_US |
dc.subject | wideband bandpass filter (BPF) | en_US |
dc.title | Enhanced Coupling Structures for Tight Couplers and Wideband Filters | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TMTT.2010.2094202 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | en_US |
dc.citation.volume | 59 | en_US |
dc.citation.issue | 3 | en_US |
dc.citation.spage | 574 | en_US |
dc.citation.epage | 583 | en_US |
dc.contributor.department | 電信工程研究所 | zh_TW |
dc.contributor.department | Institute of Communications Engineering | en_US |
dc.identifier.wosnumber | WOS:000288460500008 | - |
dc.citation.woscount | 8 | - |
Appears in Collections: | Articles |
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