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dc.contributor.authorLiang, Cheng-Hsienen_US
dc.contributor.authorChang, Wei-Shinen_US
dc.contributor.authorChang, Chi-Yangen_US
dc.date.accessioned2014-12-08T15:12:00Z-
dc.date.available2014-12-08T15:12:00Z-
dc.date.issued2011-03-01en_US
dc.identifier.issn0018-9480en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TMTT.2010.2094202en_US
dc.identifier.urihttp://hdl.handle.net/11536/9206-
dc.description.abstractTightly coupled lines are difficult to realize on the conventional printed circuit board (PCB). This paper proposes two types of novel enhanced coupled-line structures appropriate for tightly coupled directional couplers and wideband filters. The proposed coupled-line structures both have a rectangular ground-plane aperture and two inserted signal strips in the aperture to increase the coupling strength significantly. No fine lines and narrow gaps are required so as to fit the conventional PCB fabrication process. More importantly, the proposed structures only need a single-layer substrate. To demonstrate the feasibility of the proposed structures, one 3-dB directional coupler and two four-pole Chebyshev filters with 0.05-dB equal-ripple bandwidths of 40% and 37% are designed and realized. The coupler and filters are fabricated on a PCB substrate with a dielectric constant of 3.58 and a thickness of 0.508 mm. Good agreement between measurements and simulations is observed.en_US
dc.language.isoen_USen_US
dc.subjectCoupled lineen_US
dc.subjectdefected ground structure (DGS)en_US
dc.subjectdirectional coupleren_US
dc.subjectmicrostrip lineen_US
dc.subjectparallel-coupled microstrip filteren_US
dc.subjectwideband bandpass filter (BPF)en_US
dc.titleEnhanced Coupling Structures for Tight Couplers and Wideband Filtersen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TMTT.2010.2094202en_US
dc.identifier.journalIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESen_US
dc.citation.volume59en_US
dc.citation.issue3en_US
dc.citation.spage574en_US
dc.citation.epage583en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000288460500008-
dc.citation.woscount8-
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