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dc.contributor.authorChen, Fang-Chungen_US
dc.contributor.authorChen, Tzung-Daen_US
dc.contributor.authorZeng, Bing-Rueien_US
dc.contributor.authorChung, Ya-Weien_US
dc.date.accessioned2014-12-08T15:12:04Z-
dc.date.available2014-12-08T15:12:04Z-
dc.date.issued2011-03-01en_US
dc.identifier.issn0268-1242en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0268-1242/26/3/034005en_US
dc.identifier.urihttp://hdl.handle.net/11536/9255-
dc.description.abstractIn this study, we systematically investigated the bending effect on the electrical properties of flexible organic thin-film transistors (OTFTs) fabricated on stainless steel substrates. We found that the compressive strain resulted in an increased mobility, while the tensile strain degraded the electrical performance. We further used a transfer line method to extract the channel and parasitic resistances under either compressive or tensile strain. The results indicated that the parasitic resistance increased apparently under the tensile bending condition, which probably could be attributed to the damage of the source/drain contacts. Additionally, we deduced that mechanical strains influence the energy barrier height between the grains of pentacene thin films, thereby resulting in the variation of channel resistances. Overall, the flexible OTFTs fabricated on the metal foils exhibited high mechanical flexibility and stability.en_US
dc.language.isoen_USen_US
dc.titleInfluence of mechanical strain on the electrical properties of flexible organic thin-film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0268-1242/26/3/034005en_US
dc.identifier.journalSEMICONDUCTOR SCIENCE AND TECHNOLOGYen_US
dc.citation.volume26en_US
dc.citation.issue3en_US
dc.citation.epageen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000287309800006-
dc.citation.woscount12-
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