銅與低介電材料介電層之系統整合及可靠度提升研究(I)

標題:	銅與低介電材料介電層之系統整合及可靠度提升研究(I) The Reliability Enhancement for the Integrated System of Copper and Low K Dielectric Interconnect (I)
作者:	邱碧秀 CHIOU BI-SHIOU 交通大學電子工程系
公開日期:	2002
官方說明文件#:	NSC91-2216-E009-023
URI:	http://hdl.handle.net/11536/92794 https://www.grb.gov.tw/search/planDetail?id=785501&docId=151054
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.