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學術出版;;Publications
研究計畫;;Research Plans
以微電鍍法製作次微米孔穴的研究
以微電鍍法製作次微米孔穴的研究
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902212E009033.pdf
(821.63 KB)
902212E009033.pdf
(821.63 KB)
Date
2001
Authors
徐文祥
HSU WENSYANG
Journal Title
Journal ISSN
Volume Title
Publisher
DOI
Abstract
Description
Keywords
微電鍍
,
次微米孔穴
,
製造
,
Micro electroplating
,
Sub-micro aperture
,
Fabrication
Citation
URI
https://www.grb.gov.tw/search/planDetail?id=645475&docId=121268
https://ir.lib.nycu.edu.tw/handle/11536/93556
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