以微電鍍法製作次微米孔穴的研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	徐文祥	en_US
dc.contributor.author	HSU WENSYANG	en_US
dc.date.accessioned	2014-12-13T10:35:43Z	-
dc.date.available	2014-12-13T10:35:43Z	-
dc.date.issued	2001	en_US
dc.identifier.govdoc	NSC90-2212-E009-033	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93556	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=645475&docId=121268	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	微電鍍	zh_TW
dc.subject	次微米孔穴	zh_TW
dc.subject	製造	zh_TW
dc.subject	Micro electroplating	en_US
dc.subject	Sub-micro aperture	en_US
dc.subject	Fabrication	en_US
dc.title	以微電鍍法製作次微米孔穴的研究	zh_TW
dc.title	Fabrication of Sub-Micro Aperture by Micro Electroplating	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學機械工程學系	zh_TW
Appears in Collections:	Research Plans

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