以微電鍍法製作次微米孔穴的研究

標題:	以微電鍍法製作次微米孔穴的研究 Fabrication of Sub-Micro Aperture by Micro Electroplating
作者:	徐文祥 HSU WENSYANG 國立交通大學機械工程學系
關鍵字:	微電鍍;次微米孔穴;製造;Micro electroplating;Sub-micro aperture;Fabrication
公開日期:	2001
官方說明文件#:	NSC90-2212-E009-033
URI:	http://hdl.handle.net/11536/93556 https://www.grb.gov.tw/search/planDetail?id=645475&docId=121268
Appears in Collections:	Research Plans

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