多層印刷電路板中之嵌入式被動元件特性分析

Title:	多層印刷電路板中之嵌入式被動元件特性分析 Characterization of Embedded Passives on Multiplayer PCB
Authors:	吳霖？ WU LIN-KUN 國立交通大學電信工程學系
Issue Date:	2000
Gov't Doc #:	NSC89-2213-E009-196
URI:	http://hdl.handle.net/11536/93770 https://www.grb.gov.tw/search/planDetail?id=582638&docId=109402
Appears in Collections:	Research Plans

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