高性能材料之銲接與修補製程最佳化研究---子計畫三：凝膠法製備低介電係數材料之特性提升研究(II)

Full metadata record

DC Field	Value	Language
dc.contributor.author	謝宗雍	en_US
dc.contributor.author	HSIEH TSUNG-EONG	en_US
dc.date.accessioned	2014-12-13T10:36:05Z	-
dc.date.available	2014-12-13T10:36:05Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2216-E009-039	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93775	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=584716&docId=109912	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	高性能材料之銲接與修補製程最佳化研究---子計畫三：凝膠法製備低介電係數材料之特性提升研究(II)	zh_TW
dc.title	Property Enhancement of Low Dielectric Constant Material Prepared by Sol-Gel Process(II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學材料科學與工程學系	zh_TW
Appears in Collections:	Research Plans