Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 蔡明蒔 | en_US |
dc.date.accessioned | 2014-12-13T10:36:53Z | - |
dc.date.available | 2014-12-13T10:36:53Z | - |
dc.date.issued | 1999 | en_US |
dc.identifier.govdoc | NSC88-2212-E317-001 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/94238 | - |
dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=418254&docId=74201 | en_US |
dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.subject | 化學機械研磨 | zh_TW |
dc.subject | 金屬連線 | zh_TW |
dc.subject | 研磨漿料 | zh_TW |
dc.subject | 磨除率 | zh_TW |
dc.subject | 金屬研磨 | zh_TW |
dc.subject | Chemical mechanical polishing (CMP) | en_US |
dc.subject | Metal interconnection | en_US |
dc.subject | Slurry | en_US |
dc.subject | Removal rate | en_US |
dc.subject | Metal polishing | en_US |
dc.title | 線性CMP製程與實驗機台研究---子計畫VII:CMP之化學反應機制研究(I) | zh_TW |
dc.title | Study of Chemical Reactions on CMP(I) | en_US |
dc.type | Plan | en_US |
dc.contributor.department | 國立交通大學毫微米實驗室 | zh_TW |
Appears in Collections: | Research Plans |
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