線性CMP製程與實驗機台研究---子計畫VII：CMP之化學反應機制研究(I)

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DC Field	Value	Language
dc.contributor.author	蔡明蒔	en_US
dc.date.accessioned	2014-12-13T10:36:53Z	-
dc.date.available	2014-12-13T10:36:53Z	-
dc.date.issued	1999	en_US
dc.identifier.govdoc	NSC88-2212-E317-001	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/94238	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=418254&docId=74201	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	化學機械研磨	zh_TW
dc.subject	金屬連線	zh_TW
dc.subject	研磨漿料	zh_TW
dc.subject	磨除率	zh_TW
dc.subject	金屬研磨	zh_TW
dc.subject	Chemical mechanical polishing (CMP)	en_US
dc.subject	Metal interconnection	en_US
dc.subject	Slurry	en_US
dc.subject	Removal rate	en_US
dc.subject	Metal polishing	en_US
dc.title	線性CMP製程與實驗機台研究---子計畫VII：CMP之化學反應機制研究(I)	zh_TW
dc.title	Study of Chemical Reactions on CMP(I)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學毫微米實驗室	zh_TW
Appears in Collections:	Research Plans

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