完整後設資料紀錄
DC 欄位語言
dc.contributor.author曲新生en_US
dc.contributor.authorCHU, HSIN-SENen_US
dc.date.accessioned2014-12-13T10:36:57Z-
dc.date.available2014-12-13T10:36:57Z-
dc.date.issued2001en_US
dc.identifier.govdocNSC90-2212-E009-072zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/94288-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=662717&docId=125580en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject介電薄膜zh_TW
dc.subject矽晶圓zh_TW
dc.subject熱應力zh_TW
dc.subject快速加熱退火zh_TW
dc.subjectDielectric thin filmen_US
dc.subjectSilicon waferen_US
dc.subjectThermal stressen_US
dc.subjectRapid thermal annealingen_US
dc.title12吋矽晶圓半導體CVD製程設備及BST介電薄膜成長研究---子計畫Ⅱ:BST 介電薄膜在12吋矽晶圓上快速熱回火製程中熱物理性質及熱應力之研究(II)zh_TW
dc.titleStudy on the Thermal Properties and Stresses of a 12-inches Silicon Wafer with High-Dielectric BST Thin Films in Rapid Thermal Processing/Annealing(II)en_US
dc.typePlanen_US
dc.contributor.department國立交通大學機械工程研究所zh_TW
顯示於類別:研究計畫