完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | 曲新生 | en_US |
dc.contributor.author | CHU, HSIN-SEN | en_US |
dc.date.accessioned | 2014-12-13T10:36:57Z | - |
dc.date.available | 2014-12-13T10:36:57Z | - |
dc.date.issued | 2001 | en_US |
dc.identifier.govdoc | NSC90-2212-E009-072 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/94288 | - |
dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=662717&docId=125580 | en_US |
dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.subject | 介電薄膜 | zh_TW |
dc.subject | 矽晶圓 | zh_TW |
dc.subject | 熱應力 | zh_TW |
dc.subject | 快速加熱退火 | zh_TW |
dc.subject | Dielectric thin film | en_US |
dc.subject | Silicon wafer | en_US |
dc.subject | Thermal stress | en_US |
dc.subject | Rapid thermal annealing | en_US |
dc.title | 12吋矽晶圓半導體CVD製程設備及BST介電薄膜成長研究---子計畫Ⅱ:BST 介電薄膜在12吋矽晶圓上快速熱回火製程中熱物理性質及熱應力之研究(II) | zh_TW |
dc.title | Study on the Thermal Properties and Stresses of a 12-inches Silicon Wafer with High-Dielectric BST Thin Films in Rapid Thermal Processing/Annealing(II) | en_US |
dc.type | Plan | en_US |
dc.contributor.department | 國立交通大學機械工程研究所 | zh_TW |
顯示於類別: | 研究計畫 |