標題: Effect of thin film coating of Au on joint strength in Invar-Invar packages
作者: Wang, SC
Wang, CM
Wang, C
Chang, HL
Tu, YK
Hwang, CJ
Chi, S
Wang, WH
Yang, YD
Cheng, WH
光電工程學系
Department of Photonics
關鍵字: Invar material;laser welding;semiconductor laser packaging;thin film coating
公開日期: 1-十一月-1996
摘要: The effect of a thin film coating of Au on the joint strength, weld width, and penetration depth in laser welding techniques for Invar-Invar packages is investigated experimentally. It is found that the joint strength, weld width, and penetration depth are strongly dependent on the coating of Au thickness on the Invar material. The welded joints with thick Au coating show narrower weld width, shallower penetration, and hence less joint strength than those of the packages with thin Au coating. The increase in both the thermal conductivity and the vapor volume in the welded joints as the coating of Au thickness increases are the possible mechanisms for the reduction. Detailed knowledge of the effect of thin film coatings of Au on the welded materials, which gives both the highest joint strength and good adhesion, is essential for practical design and fabrication of reliable optoelectronic packaging.
URI: http://hdl.handle.net/11536/949
ISSN: 0361-5235
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 25
Issue: 11
起始頁: 1797
結束頁: 1800
顯示於類別:期刊論文