完整後設資料紀錄
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dc.contributor.author李建平en_US
dc.contributor.authorLEE CHIEN-PINGen_US
dc.date.accessioned2014-12-13T10:38:07Z-
dc.date.available2014-12-13T10:38:07Z-
dc.date.issued1998en_US
dc.identifier.govdocNSC87-2215-E009-062zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/95071-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=411110&docId=72759en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject毫米波zh_TW
dc.subject固態元件zh_TW
dc.subjectMillimeter waveen_US
dc.subjectSolid state deviceen_US
dc.title毫米波高效率的固態元件陣列研究---總計畫(III)zh_TW
dc.titleMillimeter Wave High Efficiency Solid State Deveice Array(III)en_US
dc.typePlanen_US
dc.contributor.department交通大學電子工程系zh_TW
顯示於類別:研究計畫