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dc.contributor.authorLee, Yea-Chenen_US
dc.contributor.authorLee, Chia-Enen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.contributor.authorLu, Tien-Changen_US
dc.contributor.authorWang, Shing-Chungen_US
dc.date.accessioned2014-12-08T15:12:33Z-
dc.date.available2014-12-08T15:12:33Z-
dc.date.issued2008-03-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2008.916905en_US
dc.identifier.urihttp://hdl.handle.net/11536/9629-
dc.description.abstractAlGaInP-based light-emitting diodes (LEDs) with a transparent sapphire substrate were fabricated by. the glue-bonding (GB) method. This transparent sapphire substrate is a geometric shaping structure by wet etching processes. Furthermore, the n-side-up surface has a nano-roughened texture by natural mask and chemical wet etching processes. The light output of this novel LED structure could be enhanced about 26.7% (at 350 mA) due to the higher light extraction as compared with the conventional GB-LEDs.en_US
dc.language.isoen_USen_US
dc.subjectalGaInP-based light-emitting diodes (LEDs)en_US
dc.subjectgeometric sapphire shaping light-emitting diodes (GSS-LEDs)en_US
dc.subjectglue bonding (GB)en_US
dc.subjectsapphire chemical wet etchingen_US
dc.titleEnhancing the light extraction of (AlxGa1-x)(0.5)In0.5P-based light-emitting diode fabricated via geometric sapphire shapingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2008.916905en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume20en_US
dc.citation.issue5-8en_US
dc.citation.spage369en_US
dc.citation.epage371en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000257952800015-
dc.citation.woscount8-
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