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dc.contributor.author吳耀銓en_US
dc.contributor.authorYEWCHUNG SERMONWUen_US
dc.date.accessioned2014-12-13T10:39:49Z-
dc.date.available2014-12-13T10:39:49Z-
dc.date.issued2001en_US
dc.identifier.govdocNSC90-2216-E009-037zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/96841-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=673281&docId=128270en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject晶圓接合zh_TW
dc.subject藍寶石基板zh_TW
dc.subject氮化鎵zh_TW
dc.subject雷射消融zh_TW
dc.subjectWafer bondingen_US
dc.subjectSaphhire substrateen_US
dc.subjectGallium nitrideen_US
dc.subjectLaser ablationen_US
dc.title氮化鎵晶圓接合及配合雷射移除藍寶石基板zh_TW
dc.titleGaN Wafer Bonding and Laser Lift-Off the Sapphire Substrateen_US
dc.typePlanen_US
dc.contributor.department國立交通大學材料科學與工程學系zh_TW
Appears in Collections:Research Plans


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