多層導體連線平坦化之研究---電鍍銅之電解拋光技術

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DC Field	Value	Language
dc.contributor.author	馮明憲	en_US
dc.date.accessioned	2014-12-13T10:39:50Z	-
dc.date.available	2014-12-13T10:39:50Z	-
dc.date.issued	2001	en_US
dc.identifier.govdoc	NSC90-2215-E009-062	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/96852	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=665679&docId=126368	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	平坦化	zh_TW
dc.subject	多層連結線	zh_TW
dc.subject	電解拋光	zh_TW
dc.subject	電鍍銅	zh_TW
dc.subject	Planarization	en_US
dc.subject	Multilayer interconnect	en_US
dc.subject	Electropolishing	en_US
dc.subject	Electroplated copper	en_US
dc.title	多層導體連線平坦化之研究---電鍍銅之電解拋光技術	zh_TW
dc.title	Planarization Investigation of Multi-layer Interconnects---Electropolishing Technology for Electroplated Copper	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學材料科學工程研究所	zh_TW
Appears in Collections:	Research Plans

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