薄膜構裝導線的電性分析(II)

Full metadata record

DC Field	Value	Language
dc.contributor.author	吳瑞北	en_US
dc.contributor.author	WU RUEY-BEEI	en_US
dc.date.accessioned	2014-12-13T10:40:11Z	-
dc.date.available	2014-12-13T10:40:11Z	-
dc.date.issued	1994	en_US
dc.identifier.govdoc	NSC83-0404-E002-053	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/97247	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=109839&docId=17485	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	薄膜構裝導線的電性分析(II)	zh_TW
dc.title	Electrical Analysis of Wirngs in Thin-Film Packaging (II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立台灣大學電機工程學系	zh_TW
Appears in Collections:	Research Plans