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dc.contributor.authorJian, Sheng-Ruien_US
dc.contributor.authorJuang, Jenh-Yihen_US
dc.contributor.authorLai, Yi-Shaoen_US
dc.date.accessioned2014-12-08T15:12:40Z-
dc.date.available2014-12-08T15:12:40Z-
dc.date.issued2008-02-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2836939en_US
dc.identifier.urihttp://hdl.handle.net/11536/9737-
dc.description.abstractThis article reports a nanomechanical response study of the contact-induced deformation behavior in Al(0.16)Ga(0.84)N thin film by means of a combination of nanoindentation and the cross-sectional transmission electron microscopy (XTEM) techniques. Al(0.16)Ga(0.84)N thin film is deposited by using the metal-organic chemical vapor deposition method. Hardness and Young's modulus of the Al(0.16)Ga(0.84)N films were measured by a Berkovich nanoindenter operated with the continuous contact stiffness measurements mode. The obtained values of the hardness and Young's modulus are 19.76 +/- 0.15 and 310.63 +/- 9.41 GPa, respectively. The XTEM images taken in the vicinity just underneath the indenter tip revealed that the multiple "pop-ins" observed in the load-displacement curve during loading are due primarily to the activities of dislocation nucleation and propagation. The absence of discontinuities in the unloading segments of the load-displacement curve suggests that no pressure-induced phase transition was involved. (c) 2008 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleCross-sectional transmission electron microscopy observations of structural damage in Al(0.16)Ga(0.84)N thin film under contact loadingen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2836939en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume103en_US
dc.citation.issue3en_US
dc.citation.epageen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000253238100016-
dc.citation.woscount19-
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