完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | 陳冠能 | en_US |
| dc.contributor.author | CHEN KUAN-NENG | en_US |
| dc.date.accessioned | 2014-12-13T10:41:21Z | - |
| dc.date.available | 2014-12-13T10:41:21Z | - |
| dc.date.issued | 2012 | en_US |
| dc.identifier.govdoc | NSC101-2628-E009-005 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/98389 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=2645670&docId=399140 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 三維積體電路(3D IC)之矽晶直通孔(TSV)與其它關鍵技術製程整合研究及應力量測熱傳導模型分析( III ) | zh_TW |
| dc.title | Studies of through Silicon VI a (Tsv) and Other Key Technologies in Three-Dimensional Integrated Circuit (3d Ic) with Stress Analysis and Thermal Conductivity Modeling | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 國立交通大學電子工程學系及電子研究所 | zh_TW |
| 顯示於類別： | 研究計畫 | |
