完整後設資料紀錄
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dc.contributor.authorTsai, Jia-Linen_US
dc.contributor.authorHsu, Shin-Mingen_US
dc.date.accessioned2014-12-08T15:12:48Z-
dc.date.available2014-12-08T15:12:48Z-
dc.date.issued2008-01-01en_US
dc.identifier.issn0253-3839en_US
dc.identifier.urihttp://hdl.handle.net/11536/9853-
dc.description.abstractThis study aims to investigate the organoclay effect on the mechanical properties of epoxy nanocomposites. In order to characterize the organoclay effect, three different loadings of organoclay, 2.5, 5, and 7.5 wt%, were dispersed into the epoxy with a mechanical blender followed by sonication. Tensile tests and fracture tests were carried out on these specimens to determine their stiffness, strength and fracture behaviors. The experimental results obtained from tensile tests indicate that the stiffness of the epoxy increases with the increment of organoclay inclusion; however, the corresponding failure strain decreases. On the other hand, fracture tests on single- edge-notch bending specimens reveal that the inclusion of organoclay may dramatically reduce the fracture toughness of nanocomposites. The decrease could be due to changes in the morphologies of the epoxy nanocomposites as well as the interfacial debonding between the organoclay and the surrounding epoxy.en_US
dc.language.isoen_USen_US
dc.subjectorganoclayen_US
dc.subjectnanocompositesen_US
dc.subjectfracture toughnessen_US
dc.subjecttensile strengthen_US
dc.titleInvestigating mechanical properties of epoxy/organoclay nanocompositesen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF THE CHINESE INSTITUTE OF ENGINEERSen_US
dc.citation.volume31en_US
dc.citation.issue1en_US
dc.citation.spage9en_US
dc.citation.epage16en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000252850200002-
dc.citation.woscount4-
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