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dc.contributor.authorLin, Chao-Chengen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTu, Chun-Haoen_US
dc.contributor.authorChen, Wei-Renen_US
dc.contributor.authorHu, Chih-Weien_US
dc.contributor.authorSze, Simon M.en_US
dc.contributor.authorChang, Chun-Yenen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2014-12-08T15:12:52Z-
dc.date.available2014-12-08T15:12:52Z-
dc.date.issued2008en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/9926-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2919709en_US
dc.description.abstractIn this study, distributed charge trapping centers molybdenum silicide nanodots, are demonstrated. The Mo silicide nanodots were formed in the rapid thermal annealed mixed Mo-Si layer deposited by a dual electron gun system. A significant memory effect is observed through the electrical measurements, which is attributed to the formation of Mo silicide nanodots. In addition, the memory window is large enough to be identified as logic level "0" and "1" for the application on nonvolatile memory. The manufacture processes are simple and compatible with the conventional semiconductor manufacturing processes. (C) 2008 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleFormation of Mo silicide nanodot memory by rapid thermal annealing dual electron-gun evaporated Mo-Si layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2919709en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume11en_US
dc.citation.issue7en_US
dc.citation.spageH202en_US
dc.citation.epageH203en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000255982800028-
dc.citation.woscount1-
Appears in Collections:Articles