完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, Sheng-Chieh | en_US |
dc.contributor.author | Lai, Chun-Han | en_US |
dc.contributor.author | Wu, Pu-Wei | en_US |
dc.date.accessioned | 2014-12-08T15:12:56Z | - |
dc.date.available | 2014-12-08T15:12:56Z | - |
dc.date.issued | 2008 | en_US |
dc.identifier.issn | 1099-0062 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/9981 | - |
dc.identifier.uri | http://dx.doi.org/10.1149/1.2798921 | en_US |
dc.description.abstract | A nanoporous semiconducting template was fabricated by conformal deposition of Ni-P over anodic aluminum oxide (AAO). Electroless plating was conducted in repeated steps of sensitization, activation, and deposition using NaH2PO2 as a reducing agent. Variables including pH, temperature, time, and additive were studied for conformal deposition within the pore channels without clogging the openings prematurely. We demonstrated concentric Ni-P tubes with an inner diameter of 84 nm at 10 mu m length. Resistivity of the AAO template was determined at 39.6 Omega cm for through-channel direction. Incorporation of the semiconducting AAO structure with established template synthesis technologies opens up the opportunity for numerous devices. (C) 2007 The Electrochemical Society. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Conformal deposition of Ni-P on anodic aluminum oxide template | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1149/1.2798921 | en_US |
dc.identifier.journal | ELECTROCHEMICAL AND SOLID STATE LETTERS | en_US |
dc.citation.volume | 11 | en_US |
dc.citation.issue | 1 | en_US |
dc.citation.spage | D1 | en_US |
dc.citation.epage | D4 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000250983500009 | - |
dc.citation.woscount | 3 | - |
顯示於類別: | 期刊論文 |