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dc.contributor.authorLu, Hau-Yanen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorLi, Hung-Weien_US
dc.contributor.authorHu, Chin-Weien_US
dc.contributor.authorLin, Kun-Chihen_US
dc.contributor.authorTai, Ya-Hsiangen_US
dc.contributor.authorChi, Sienen_US
dc.date.accessioned2014-12-08T15:12:56Z-
dc.date.available2014-12-08T15:12:56Z-
dc.date.issued2008en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/9984-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2859388en_US
dc.description.abstractA technology to eliminate the photoleakage current of poly-Si thin-film transistors (TFTs) with top gate structure has been developed. A thin metal film is formed on the glass substrate to be used as a light-shielding layer. The light-shielding layer, buffer layer, and active island are patterned employing the same mask. The leakage current and the variation of subthreshold swing in the proposed devices are suppressed completely under illumination. Due to the parasitic capacitance in the overlap region between the drain side and the metal-shielding layer, a floating voltage coupled from drain bias influences the threshold voltage of the proposed poly-Si TFTs. (c) 2008 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleElimination of photoleakage current in poly-Si TFTs using a metal-shielding structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2859388en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume11en_US
dc.citation.issue5en_US
dc.citation.spageJ34en_US
dc.citation.epageJ36en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000253989800026-
dc.citation.woscount3-
Appears in Collections:Articles