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Low temperature improvement on silicon oxide grown by electron-gun evaporation for resistance memory applications

dc.citation.epageen_US
dc.citation.issue5en_US
dc.citation.volume93en_US
dc.citation.woscount6
dc.contributor.authorTsai, Chih-Tsungen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorCheng, Yi-Lien_US
dc.contributor.authorHuang, Fon-Shanen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.date.accessioned2014-12-08T15:11:03Z
dc.date.available2014-12-08T15:11:03Z
dc.date.issued2008-08-04en_US
dc.description.abstractIn this work, the supercritical CO(2) fluid mixed with cosolvents is introduced to terminate the traps in electron-gun (e-gun) evaporation deposited silicon oxide (SiO(x)) film at 150 degrees C. After the proposed treatment, the SiO(x) film exhibits a lower leakage current and a resistive switching behavior that is controllable by applying proper voltage bias. The change in resistance is over 10(2) times and the retention time attains to 2x10(3) s. It is also discovered that the resistive switching behavior seemingly relates to the amount of traps. (C) 2008 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2957655en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2957655en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/8477
dc.identifier.wosnumberWOS:000258335900050
dc.language.isoen_USen_US
dc.titleLow temperature improvement on silicon oxide grown by electron-gun evaporation for resistance memory applicationsen_US
dc.typeArticleen_US

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