<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Model to determine the self-resonant frequency of micromachined spiral inductors

dc.citation.epageen_US
dc.citation.issue10en_US
dc.citation.volume89en_US
dc.citation.woscount0
dc.contributor.authorChen, C. C.en_US
dc.contributor.authorLin, Cheng-Deen_US
dc.contributor.authorCheng, Y. T.en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:15:49Z
dc.date.available2014-12-08T15:15:49Z
dc.date.issued2006-09-04en_US
dc.description.abstractThis letter presents an approach to characterize electron behaviors within polygonal micromachined spiral inductors in which self-resonance occurs. Combining with the concepts of anomalous dispersion, standing wave, and field scattering, the self-resonant frequency of the microinductors can be calculated by means of an associated analytical model. According to this model the self-resonant frequency (SRF) can be derived as the "free electron" frequency of the inductor material. Simulation and measurement results validate that the model can provide a satisfactory prediction to the SRF of polygonal micromachined spiral inductors. (c) 2006 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2346371en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2346371en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/11797
dc.identifier.wosnumberWOS:000240384000107
dc.language.isoen_USen_US
dc.titleModel to determine the self-resonant frequency of micromachined spiral inductorsen_US
dc.typeArticleen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
000240384000107.pdf
Size:
426.01 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: