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Improvement of the performance of TiHfO MIM capacitors by using a dual plasma treatment of the lower electrode

dc.citation.epage1107en_US
dc.citation.issue10en_US
dc.citation.spage1105en_US
dc.citation.volume29en_US
dc.citation.woscount17
dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorPan, H. C.en_US
dc.contributor.authorHuang, C. C.en_US
dc.contributor.authorChou, C. P.en_US
dc.contributor.authorHsiao, C. N.en_US
dc.contributor.authorHu, J.en_US
dc.contributor.authorHwang, M.en_US
dc.contributor.authorArikado, T.en_US
dc.contributor.authorMcAlister, S. P.en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:10:51Z
dc.date.available2014-12-08T15:10:51Z
dc.date.issued2008-10-01en_US
dc.description.abstractWe show that a conventional nitrogen plasma treatment is insufficient to suppress the formation of an interfacial layer at the bottom electrode of TiHfO metal-insulator-metal (MIM) capacitors. However, the capacitance density and leakage current of TaN/TiHfO/TaN MIM capacitors monotonically improve by exposing the lower TaN electrode to an additional oxygen plasma treatment. By performing dual oxygen and nitrogen plasma treatments on the lower electrode, the leakage current was 4.8 x 10(-6) A/cm(2) (at -1 V) at a 28 fF/mu m(2) capacitance density.en_US
dc.identifier.doi10.1109/LED.2008.2000945en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2008.2000945en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/8303
dc.identifier.wosnumberWOS:000259812900007
dc.language.isoen_USen_US
dc.subjecthigh kappaen_US
dc.subjectmetal-insulator-metal (MIM)en_US
dc.subjectplasma treatmenten_US
dc.subjectTiHfOen_US
dc.titleImprovement of the performance of TiHfO MIM capacitors by using a dual plasma treatment of the lower electrodeen_US
dc.typeArticleen_US

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