Effect of moisture on electrical properties and reliability of low dielectric constant materials
| dc.citation.epage | 16 | en_US |
| dc.citation.issue | en_US | |
| dc.citation.spage | 12 | en_US |
| dc.citation.volume | 114 | en_US |
| dc.citation.woscount | 5 | |
| dc.contributor.author | Cheng, Yi-Lung | en_US |
| dc.contributor.author | Leon, Ka-Wai | en_US |
| dc.contributor.author | Huang, Jun-Fu | en_US |
| dc.contributor.author | Chang, Wei-Yuan | en_US |
| dc.contributor.author | Chang, Yu-Min | en_US |
| dc.contributor.author | Leu, Jihperng | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:33:54Z | |
| dc.date.available | 2014-12-08T15:33:54Z | |
| dc.date.issued | 2014-02-01 | en_US |
| dc.description.abstract | The effect of absorbed moisture on the electrical characteristics and reliability of low dielectric constant materials (low-k) was investigated in this study. The experimental results reveal that porous low-k dielectrics absorb more moisture than dense low-k dielectrics. This absorbed moisture degrades the electrical performance and reliability of both classes of low-k dielectrics. Annealing at a higher temperature of 400 degrees C is required to decompose the physically-adsorbed moisture and thereby restore reliability performance. However, the chemically-adsorbed moisture seems to be difficult to remove by annealing at 400 degrees C, causing a degraded TDDB performance. Crown Copyright (C) 2013 Published by Elsevier B.V. All rights reserved. | en_US |
| dc.identifier.doi | 10.1016/j.mee.2013.08.018 | en_US |
| dc.identifier.issn | 0167-9317 | en_US |
| dc.identifier.journal | MICROELECTRONIC ENGINEERING | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1016/j.mee.2013.08.018 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/23370 | |
| dc.identifier.wosnumber | WOS:000329417600003 | |
| dc.language.iso | en_US | en_US |
| dc.subject | Low-k dielectric | en_US |
| dc.subject | Porogen | en_US |
| dc.subject | Moisture | en_US |
| dc.subject | Reliability | en_US |
| dc.subject | Breakdown | en_US |
| dc.subject | TDDB | en_US |
| dc.subject | Electromigration | en_US |
| dc.title | Effect of moisture on electrical properties and reliability of low dielectric constant materials | en_US |
| dc.type | Article | en_US |