<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Improvement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablation

dc.citation.epage53en_US
dc.citation.spage48en_US
dc.citation.volume95en_US
dc.citation.woscount0en_US
dc.contributor.authorKu, Chun-Hanen_US
dc.contributor.authorWang, Wei-Kaien_US
dc.contributor.authorHorng, Ray-Huaen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2019-04-02T05:58:20Z
dc.date.available2019-04-02T05:58:20Z
dc.date.issued2019-06-01en_US
dc.description.abstractMesh-textured flip-chip (FC) structures of AlGaN-based near ultraviolet-light-emitting diodes (NUV-LEDs) are fabricated using an Nd:YAG laser scriber. Compared with the output power of the reference FC-LEDs, those of conventional sapphire substrate (CSS) FC-LEDs and the patterned sapphire substrate FC-LEDs with laser-scribed mesh-textured backsides were improved by 28.7% and 7.2%, respectively. The CSS FC-LED is enhanced using the mesh-textured trench pattern attributable to an increase in the light-extraction efficiency resulting from an increase in the photon-escape probability due to enhanced light scattering at the trench-patterned-sapphire/air interface. Furthermore, the current-voltage curves depict that the laser scribing process does not adversely affect the electrical properties of the FC-LEDs. A Trace-Pro simulation revealed that the laser-scribed-trench CSS FC-LED is effective for light extraction.en_US
dc.identifier.doi10.1016/j.mssp.2019.02.011en_US
dc.identifier.issn1369-8001en_US
dc.identifier.journalMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSINGen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mssp.2019.02.011en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/148940
dc.identifier.wosnumberWOS:000459939300007en_US
dc.language.isoen_USen_US
dc.titleImprovement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablationen_US
dc.typeArticleen_US

Files

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: