多晶片模組之基板製成與晶片接合技術的研究---子計畫III：苯并環丁烯薄膜在矽與鋁上黏著特性之研究(I)

dc.contributor.author	謝宗雍	en_US
dc.contributor.author	HSIEH TSUNG-EONG	en_US
dc.contributor.department	國立交通大學材料科學工程研究所	zh_TW
dc.date.accessioned	2014-12-13T10:39:29Z
dc.date.available	2014-12-13T10:39:29Z
dc.date.issued	1995	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC84-2215-E009-065	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=198972&docId=34812	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/96544
dc.language.iso	zh_TW	en_US
dc.subject	苯并環丁烯	zh_TW
dc.subject	附著性	zh_TW
dc.subject	剝離試驗	zh_TW
dc.subject	電子構裝	zh_TW
dc.subject	薄膜	zh_TW
dc.subject	矽	zh_TW
dc.subject	鋁	zh_TW
dc.subject	Benzocyclobutene	en_US
dc.subject	Adhesion property	en_US
dc.subject	Peel test	en_US
dc.subject	Electronic packaging	en_US
dc.subject	Thinfilm	en_US
dc.subject	Silicon	en_US
dc.subject	Aluminum	en_US
dc.title	多晶片模組之基板製成與晶片接合技術的研究---子計畫III：苯并環丁烯薄膜在矽與鋁上黏著特性之研究(I)	zh_TW
dc.title	A Study of Adhesion Property of Benzocyclobutene(BCB) Thin Film on Si and Al(I)	en_US
dc.type	Plan	en_US

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