矽晶絕緣層之雷射超音波檢測及評估

dc.contributor.author	尹慶中	en_US
dc.contributor.author	YIN CHING-CHUNG	en_US
dc.contributor.department	交通大學機械工程系	zh_TW
dc.date.accessioned	2014-12-13T10:50:25Z
dc.date.available	2014-12-13T10:50:25Z
dc.date.issued	2000	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC89-2212-E009-004	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=501413&docId=90420	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/102137
dc.language.iso	zh_TW	en_US
dc.subject	雷射超音波	zh_TW
dc.subject	矽晶絕緣	zh_TW
dc.subject	破壞韌性	zh_TW
dc.subject	聲射	zh_TW
dc.subject	Laser induced ultrasound	en_US
dc.subject	Silicon on insulator	en_US
dc.subject	Fracture toughness Acoustic emission	en_US
dc.title	矽晶絕緣層之雷射超音波檢測及評估	zh_TW
dc.title	Evaluation of Silicon-On-Insulator by Wafer Bonding Using Laser-Induced Ultrasound	en_US
dc.type	Plan	en_US

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