<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Study on degradation of crystallized laterally grown poly-Si TFT under Dynamic Stress

Abstract

The influence of protrusion grain boundary on the degradation of crystallized laterally grown poly-Si TFT under Dynamic Stress is investigated. The degradation of TFT with protrusion grain boundary is more severe and the different damage of the source/drain junction in the TFT with grain boundary closed to source side.

Description

Keywords

Citation

Endorsement

Review

Supplemented By

Referenced By