高密度電子構裝接合與測試載具的開發---子計畫III：多層傳導結構基板之可靠度提升與製作研究(III)

dc.contributor.author	謝宗雍	en_US
dc.contributor.author	HSIEH TSUNG-EONG	en_US
dc.contributor.department	交通大學材料科學與工程系	zh_TW
dc.date.accessioned	2014-12-13T10:37:14Z
dc.date.available	2014-12-13T10:37:14Z
dc.date.issued	1999	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC88-2216-E009-013	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=429291&docId=76850	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/94468
dc.language.iso	zh_TW	en_US
dc.subject	多層連線	zh_TW
dc.subject	基板	zh_TW
dc.subject	平坦化	zh_TW
dc.subject	銅導孔柱	zh_TW
dc.subject	Multilayer interconnection	en_US
dc.subject	Substrate	en_US
dc.subject	Planarization	en_US
dc.subject	Cu via pillar	en_US
dc.title	高密度電子構裝接合與測試載具的開發---子計畫III：多層傳導結構基板之可靠度提升與製作研究(III)	zh_TW
dc.title	A Study of Reliability Enhancement and Fabrication of Multilayer Interconnection Substarte (III)	en_US
dc.type	Plan	en_US

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