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A Cu-based alloyed ohmic contact system on n-type GaAs

dc.citation.epageen_US
dc.citation.issue23en_US
dc.citation.volume91en_US
dc.citation.woscount0
dc.contributor.authorChen, Ke-Shianen_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorLin, Chia-Chingen_US
dc.contributor.authorLee, Cheng-Shihen_US
dc.contributor.authorHuang, Wei-Chingen_US
dc.contributor.authorLee, Ching-Tingen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:12:59Z
dc.date.available2014-12-08T15:12:59Z
dc.date.issued2007-12-03en_US
dc.description.abstractAn alloyed Pd/Ge/Cu Ohmic contact to n-type GaAs is reported for the first time. The Pd/Ge/Cu Ohmic contact exhibited a very low specific contact resistance of 5.73x10(-7) Omega cm(2) at a low annealing temperature of 250 degrees C. This result is comparable to the reported Pd/Ge and Au/Ge/Ni Ohmic contact systems to n-type GaAs with doping concentrations about 1x10(18) cm(-3). The Ohmic contact formation mechanisms and microstructure evolution were investigated using secondary ion mass spectrometry, x-ray diffraction, transmission electron microscopy, and energy dispersive spectrometer. The Ohmic contact behavior was related to the formation of Cu(3)Ge and PdGa(x)As(y) compounds after annealing. (c) 2007 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2819687en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2819687en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/10016
dc.identifier.wosnumberWOS:000251450600112
dc.language.isoen_USen_US
dc.titleA Cu-based alloyed ohmic contact system on n-type GaAsen_US
dc.typeArticleen_US

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