<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

矽化物超淺接面和接觸孔研發

dc.contributor.author雷添福en_US
dc.contributor.authorLEI TAN-FUen_US
dc.contributor.department交通大學電子工程研究所zh_TW
dc.date.accessioned2014-12-13T10:35:29Z
dc.date.available2014-12-13T10:35:29Z
dc.date.issued2001en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC90-2215-E009-095zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=665784&docId=126394en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93461
dc.language.isozh_TWen_US
dc.subject積體電路設計zh_TW
dc.subject超淺接面zh_TW
dc.subject接觸孔zh_TW
dc.subjectIntegrated circuit designen_US
dc.subjectUltra-shallow junctionen_US
dc.subjectContact holeen_US
dc.title矽化物超淺接面和接觸孔研發zh_TW
dc.titleDevelopment of Silicide Ultra-Sallow Junction and Contact Holeen_US
dc.typePlanen_US

Files

Original bundle

Now showing 1 - 2 of 2
Loading...
Thumbnail Image
Name:
902215E009095.pdf
Size:
998.38 KB
Format:
Adobe Portable Document Format
Loading...
Thumbnail Image
Name:
902215E009095.pdf
Size:
998.38 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: